TECHNICAL DATA SHEET

LIQUID FLUX 330

No-clean flux

STANNOL GmbH & Co. KG • TDB_LF_EF330_EN • Issue: 10.03.2026

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Haberstr. 24 • 42551 Velbert • Tel: +49 (0)2051-3120-0 • Fax: +49 (0)2051-3120-111 • E-Mail: info@stannol.de • www.stannol.de

DESCRIPTION

No-clean flux classified as type 2.2.3.A according to DIN-EN 29454-1, type ORL0 according to EN 61190-1-1 and type ORL0

according to J-STD-004.

Stannol EasyFlux 330 is halide free activated. The new formula of the activators guarantees an optimum wetting of the

different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit

boards with alternative surfaces are introduced. Also the soldering with lead-free alloys show perfect wetting results. Best

results were achieved when using Stannol Ecoloy and Flowtin TSC (Tin/Silver/Copper), TS (Tin/Silver) and TC (Tin/Copper)

alloys.

CHARACTERISTICS

Stannol EasyFlux 330 offers the following advantages:

• Multi-purpose application, low residues

• Moderate solid content – fast wetting

• No-clean application, electrically safe

• Resin-free

• Perfect wetting results with lead-free alloys

APPLICATION

The Stannol EasyFlux 330 has been developed for application with spray fluxers, but foam fluxers can also be used. The

preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.

This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.

Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the

density increases. This can be checked with the Stannol Mini-Titration-Kit.

PHYSICAL PROPERTIES AND DATA

GENERAL PROPERTIES

EasyFlux 330

Colour:

colourless

Density at (20°C):

0,811 g/cm3

Flash point (closed crucible):

12°C

Ignition temperature:

425°C

Solid content:

3,3%

Acid rating:

26,5 mg KOH/g

Halide content:

none

Thinner

Stannol VD-500