DESCRIPTION
No-clean flux classified as type 2.2.3.A according to DIN-EN 29454-1, type ORL0 according to EN 61190-1-1 and type ORL0
according to J-STD-004.
Stannol EasyFlux 330 is halide free activated. The new formula of the activators guarantees an optimum wetting of the
different surfaces (such as OSP, Ni/Au, HAL) used in PCB manufacturing and so avoids problems when new printed circuit
boards with alternative surfaces are introduced. Also the soldering with lead-free alloys show perfect wetting results. Best
results were achieved when using Stannol Ecoloy and Flowtin TSC (Tin/Silver/Copper), TS (Tin/Silver) and TC (Tin/Copper)
alloys.
APPLICATION
The Stannol EasyFlux 330 has been developed for application with spray fluxers, but foam fluxers can also be used. The
preheat temperature should be at least 90° C measured on the surface of the circuit board when entering the solder wave.
This temperature ensures the evaporation of the solvent and a sufficient activation of the flux.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.