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RP515K103C bảng dữ liệu(PDF) 27 Page - Nisshinbo Micro Devices Inc. |
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RP515K103C bảng dữ liệu(HTML) 27 Page - Nisshinbo Micro Devices Inc. |
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27 / 32 page ![]() VISUAL INSPECTION CRITERIA WLCSP VI-160823 i No. Inspection Items Inspection Criteria Figure 1 Package chipping A 0.2mm is rejected B 0.2mm is rejected C 0.2mm is rejected And, Package chipping to Si surface and to bump is rejected. 2 Si surface chipping A 0.2mm is rejected B 0.2mm is rejected C 0.2mm is rejected But, even if A 0.2mm, B0.1mm is acceptable. 3 No bump No bump is rejected. 4 Marking miss To reject incorrect marking, such as another product name marking or another lot No. marking. 5 No marking To reject no marking on the package. 6 Reverse direction of marking To reject reverse direction of marking character. 7 Defective marking To reject unreadable marking. (Microscope: X15/ White LED/ Viewed from vertical direction) 8 Scratch To reject unreadable marking character by scratch. (Microscope: X15/ White LED/ Viewed from vertical direction) 9 Stain and Foreign material To reject unreadable marking character by stain and foreign material. (Microscope: X15/ White LED/ Viewed from vertical direction) |
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