5 Specifications

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VPUP

DC voltage applied to data

–0.3

5.5

V

IOL

Low-level output current

30

mA

TSTG

Storage temperature

–40

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±250

ESD IEC 61000-4-2 Air discharge, SDQ single-wire serial interface and

GND

±15000

V

(1)

JEDEC document JEP155 states that 500VHBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250VCDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VPUP

Operational pull-up voltage

3.13

5.25

V

RPUP

Serial communication interface pull-up resistance

500

Ω

TA

Operating free-air temperature

-10

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

DRP (VSON)

TO-92 (LP)

UNIT

6 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

50.1

129.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

54.3

93.6

°C/W

RθJB

Junction-to-board thermal resistance

21.8

99.3

°C/W

ψJT

Junction-to-top characterization parameter

0.9

23.7

°C/W

ψJB

Junction-to-board characterization parameter

21.7

99.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

5.9

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TMF0020

SLVSJQ4 – MAY 2026

www.ti.com

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