ISO7240CF datasheet(9/16 Pages) TI

9 / 16 page

THERMAL CHARACTERISTICS

TYPICAL CHARACTERISTIC CURVES

1.05

1.1

1.15

1.2

1.25

1.3

1.35

1.4

-40 -25 -10

20 35

65 80

110 125

AirFlowat7cf/m,

Low-KBoard

5V,Vth+

3.3V,Vth+

5V,Vth-

3.3V,Vth-

T -Free-AirTemperature- C

-40 -25 -10

110 125

T -Free-AirTemperature- C

3.3V

tPLH

tPHL

tPLH

tPHL

Load=15pF,

AirFlowat7cf/m,

Low-KBoard

ISO7240CF

www.ti.com ................................................................................................................................................ SLLS869B – SEPTEMBER 2007 – REVISED APRIL 2008

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-K Thermal Resistance(1)

168

Junction-to-air

°C/W

High-K Thermal Resistance

96.1

Junction-to-Board Thermal Resistance

°C/W

Junction-to-Case Thermal Resistance

°C/W

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,

Device Power Dissipation

220

Input a 12.5 MHz 50% duty cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

REGULATORY INFORMATION

Recognized under 1577 Component Recognition Program(1)

File Number: E181974

(1)

Production tested

≥ 3000 VRMS for 1 second in accordance with UL

1577.

PROPAGATION DELAY

INPUT THRESHOLD VOLTAGE

FREE-AIR TEMPERATURE

Figure 5.

Figure 6.

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