PRODUCT SPECIFICATION

Micro-Fit + Connector System Web Page

TABLE OF CONTENTS

REVISION:

ECM INFORMATION:

TITLE:

MICRO-FIT + WTB PRODCUT SPEC

WIRE TO BOARD CONNECTOR SYSTEM

SHEET No.

D3

EC No:

646943

19 of 23

DATE:

10/12/2020202

2/10/17

DOCUMENT NUMBER:

DOC

TYPE:

DOC

PART:

CREATED / REVISED BY:

CHECKED BY:

APPROVED BY:

2064600000-PS

PS

000

ZIXUAQ

NCSR

NCSR

TEMPLATE FILENAME: 1703070003 REV A

8.0

SOLDER INFORMATION

Per SMES-152 and AS-40000-5013

*These specifications establish standard solderability test methods used to evaluate a products ability to

accept molten solder. Solder Process Temperatures and Reflow Solder Profiles will vary based on

application, equipment, solder paste, PCB thickness, etc.

8.1

SOLDER PROCESS TEMPERATURES *

Wave Solder Temperature:

260°C Maximum

Reflow Solder Temperature: 260°C Maximum

8.2

SOLDERING PROFILE

(This profile is per JEDEC J-STD-020D.1 and it is for guideline only; please see notes for additional

information)

Molex Solderability Specification

SMES-152

(Click Here)

Molex Connector Heat Resistance

Specification AS-40000-5013

(Click Here)