CY28329

Rev 1.0, November 24, 2006

Page 7 of 16

Absolute Maximum Conditions

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Supply Voltage..................................................–0.5 to +7.0V

Storage Temperature (Non-Condensing) ....–65°C to +150°C

Max. Soldering Temperature (10 sec.) ...................... +260°C

Junction Temperature................................................ +150°C

Package Power Dissipation.............................................. 1W

Static Discharge Voltage ........................................................

(per MIL-STD-883, Method 3015) ............................ > 2000V

Parameter

Description

Min.

Max.

Unit

3.3V Supply Voltages

3.135

3.465

V

Operating Temperature, Ambient

0

70

C

Input Pin Capacitance

5

pF

XTAL Pin Capacitance

22.5

pF

Max. Capacitive Load on

USBCLK, REF

PCICLK, 3V66

20

30

pF

Reference Frequency, Oscillator Nominal Value

14.318

14.318

MHz

Parameter

Description

Test Conditions

Min. Max. Unit

High-level Input Voltage

2.0

V

Low-level Input Voltage

Except Crystal Pads

0.8

V

High-level Output Voltage

USB, REF, 3V66

2.4

V

PCI

2.4

V

Low-level Output Voltage

USB, REF, 3V66

0.4

V

PCI

0.55

V

Input High Current

–5

5

mA

Input Low Current

–5

5

mA

High-level Output Current

CPU

12.9

mA

14.9

REF, DOT, USB

–29

–23

3V66, DOT, PCI

–33

–33

Low-level Output Current

REF, DOT, USB

29

mA

27

3V66, PCI

30

38

Output Leakage Current

Three-state

10

mA

360

mA

3.3V Shutdown Current

25

mA

3.3V Shutdown Current

45

mA

Note:

7. Multiple Supplies: the voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.