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AD9785-EBZ bảng dữ liệu(PDF) 6 Page - Analog Devices |
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AD9785-EBZ bảng dữ liệu(HTML) 6 Page - Analog Devices |
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6 / 64 page ![]() AD9785/AD9787/AD9788 Rev. 0 | Page 6 of 64 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating AVDD33 to AGND, DGND, CGND −0.3 V to +3.6 V DVDD33, DVDD18, CVDD18 to AGND, DGND, CGND −0.3 V to +2.1 V AGND to DGND, CGND −0.3 V to +0.3 V DGND to AGND, CGND −0.3 V to +0.3 V CGND to AGND, DGND −0.3 V to +0.3 V I120, VREF, IPTAT to AGND −0.3 V to AVDD33 + 0.3 V OUT1_P, OUT1_N, OUT2_P, OUT2_N, AUX1_P, AUX1_N, AUX2_P, AUX2_N to AGND −1.0 V to AVDD33 + 0.3 V P1D[15] to P1D[0], P2D[15] to P2D[0] to DGND −0.3 V to DVDD33 + 0.3 V DATACLK, TXENABLE to DGND −0.3 V to DVDD33 + 0.3 V REFCLK+, REFCLK−, RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O−, SYNC_I+, SYNC_I− to CGND −0.3 V to CVDD18 + 0.3 V RESET, IRQ, PLL_LOCK, SYNC_O+, SYNC_O−, SYNC_I+, SYNC_I−, SPI_CSB, SCLK, SPI_SDIO, SPI_SDO to DGND −0.3 V to DVDD33 + 0.3 V Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE For this 100-lead, thermally enhanced TQFP, the exposed paddle (EPAD) must be soldered to the ground plane. Note that these specifications are valid with no airflow movement. Table 5. Thermal Resistance Resistance Unit Conditions θJA 19.1°C/W EPAD soldered. No airflow. θJB 12.4°C/W EPAD soldered. No airflow. θJC 7.1°C/W EPAD soldered. No airflow. ESD CAUTION |
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