ISB35166 datasheet(10/15 Pages) STMICROELECTRONICS

10 / 15 page

PACKAGE AVAILABILITY

The ISB28000 Series is designed to be compatible

with QFP, BGA and SBC package types, in addition

to the more traditional types found.

The options include Plastic Leaded Chip Carriers

(PLCC) from 28 to 84 pins, while the Metric Quad

Flat Pack (xQFP) offering ranges up to 304 pins.

Both high performance and high power variants are

available as well as the TQFP thin types.

Ball Grid Array (BGA) packages are available from

160 to 500 pins and SBC types allow the pin count

to reach the area of 1000 pins.

Pin counts for through board mounting range up to

299. For higher pin counts the range is compatible

with the industry standard JEDEC and EIA-J Guar-

dring Quad Flatpack (GQPF) with pin counts from

186 to 304.

The diversity in pin count and package style gives

the designer the opportunity to find the best com-

promise for system size, cost and performance

requirements.

All packages for the military market are hermetically

sealed to meet MIL-STD-883 Method. Prototypes

are developed in ceramic packages for fast turn-

around evaluation.

100

200

300

400

500

600

700

Plastic Chip Carrier

Pin Grid Array

BGA and HP BGA

Plastic Quad Flatpack

Guardring Quad GQFP

NOW

PLANNED

Power QFP Spreader

and Slug based

Thin Quad Flatpack

PIN COUNT

304

447

225

700+

144

304

208

304

Lead Pitch

0.5&0.65 mm

0.5mm

0.5&0.65 mm

0.5mm

Large

ISB35_VB

Figure 6. Packaging Capability

ISB35000 SERIES

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