6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

AVCC to GND, PVCC to GND

–0.3

20

V

Input current

To any pin except supply pins

10

mA

Slew rate, maximum(2)

SD/ FAULT to GND, GAIN_SEL, MODE_SEL, MUTE

10

V/ms

Interface pin voltage

SD/ FAULT to GND, GAIN_SEL, MODE_SEL, MUTE

–0.3

AVCC + 0.3

V

PLIMIT

-0.3

GVDD + 0.3

V

RINN, RINP, LINN, LINP

–0.3

5.5

V

Minimum load resistance, RL

BTL, (10 V ≤ PVCC ≤ 14.4 V)

4.8

Ω

BTL, (3.5 V < PVCC < 10 V)

3.2

PBTL, (10 V ≤ PVCC < 14.4 V)

2.4

PBTL, (3.5 V ≤ PVCC < 10 V)

1.6

Continuous total power dissipation

See the Thermal Information

Table

Operating Juncation Temperature range

–25

150

°C

Storage temperature range, Tstg

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100 kΩ resister in series

with the pins.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±1000

V

Charged device model (CDM), per JEDEC specification JESD22-C101 (2)

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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TPA3139D2

SLOS810A – OCTOBER 2019 – REVISED AUGUST 2020

Copyright © 2020 Texas Instruments Incorporated

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