TPA3136D2 datasheet(29/41 Pages) TI2

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9 Power Supply Recommendations

9.1 Power Supply Decoupling, CS

The TPA3139D2 device is a high-performance CMOS audio amplifier that requires adequate power supply

decoupling to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply

decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. Optimum

decoupling is achieved by using a network of capacitors of different types that target specific types of noise on

the power supply leads. For higher frequency transients due to parasitic circuit elements such as bond wire and

copper trace inductances as well as lead frame capacitance, a good quality low equivalent-series-resistance

(ESR) ceramic capacitor of value between 220 pF and 1000 pF works well. This capacitor should be placed as

close to the device PVCC pins and system ground (either GND pins or thermal pad) as possible. For mid-

frequency noise due to filter resonances or PWM switching transients as well as digital hash on the line, another

good quality capacitor typically 0.1 μF to 1 µF placed as close as possible to the device PVCC leads works best.

For filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 100 μF or greater placed

near the audio power amplifier is recommended. The 100-μF capacitor also serves as a local storage capacitor

for supplying current during large signal transients on the amplifier outputs. The PVCC pins provide the power to

the output transistors, so a 100-µF or larger capacitor should be placed on each PVCC pin. A 1-µF capacitor on

the AVCC pin is adequate. Also, a small decoupling resistor between AVCC and PVCC can be used to keep high

frequency class-D noise from entering the linear input amplifiers.

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TPA3139D2

SLOS810A – OCTOBER 2019 – REVISED AUGUST 2020

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TPA3136D2 bảng dữ liệu(PDF) 29 Page - Texas Instruments