UCD3138 datasheet(14/99 Pages) TI2

14 / 99 page

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

V33D

V33D to DGND

–0.3

3.8

V33DIO

V33DIO to DGND

–0.3

3.8

V33A

V33A to AGND

–0.3

3.8

BP18

BP18 to DGND

–0.3

2.5

|DGND – AGND|

Ground difference

0.3

All pins, excluding

AGND(2)

Voltage applied to any pin

–0.3

3.8

Junction temperature

–40

150

°C

Tstg

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Referenced to DGND

8.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V33D

Digital power

3.0

3.3

3.6

V33DIO

Digital I/O power

3.0

3.3

3.6

V33A

Analog power

3.0

3.3

3.6

Junction temperature

–40

125

°C

BP18

1.8-V digital power

1.6

1.8

2.0

8.4 Thermal Information

THERMAL METRIC(1)

UCD3138

UNIT

64 PIN QFN

(RGC)

40 PIN QFN

(RHA)

40 PIN QFN

(RMH)

40 PIN QFN

(RJA)

RθJA

Junction-to-ambient thermal resistance

25.1

31.8

31.0

30.1

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

10.5

18.5

16.5

13.5

°C/W

RθJB

Junction-to-board thermal resistance

4.6

6.8

6.3

4.9

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

4.6

6.7

6.3

4.8

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

1.2

1.8

1.1

0.7

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics application

report.

UCD3138

SLUSAP2J – MARCH 2012 – REVISED NOVEMBER 2021

www.ti.com

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