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PACKAGE OUTLINE

C

14X 0.30

0.18

14X 0.5

0.3

1 MAX

0.05

0.00

2X

2

8X 0.5

2.05 0.1

2X 1.5

A

3.65

3.35

B

3.65

3.35

(0.2) TYP

VQFN - 1 mm max height

RGY0014A

PLASTIC QUAD FLATPACK - NO LEAD

4219040/A 09/2015

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

14

13

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

6

7

8

9

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

2

SCALE 3.200