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PACKAGE OUTLINE

C

8X

0.3

0.2

2.4 0.1

2X

1.5

1.45 0.1

6X 0.5

0.8

0.7

8X

0.6

0.4

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(DIM A) TYP

OPT 01 SHOWN

WSON - 0.8 mm max height

DRG0008B

PLASTIC SMALL OUTLINE - NO LEAD

4218886/A 01/2020

DIMENSION A

OPTION 01

(0.1)

OPTION 02

(0.2)

PIN 1 INDEX AREA

SEATING PLANE

0.05 C

1

4

5

8

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.08

C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000