LP2998, LP2998-Q1

www.ti.com

SNVS521K – DECEMBER 2007 – REVISED AUGUST 2014

Electrical Characteristics (continued)

Typical limits tested at TJ = 25°C. Minimum and maximum limits apply over the full operating junction temperature range (TJ =

–40°C to 125°C).

(1) Unless otherwise specified, AVIN = PVIN = 2.5 V, VDDQ = 2.5 V.(2)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IOUT = 0 A

–30

0

30

VTT Output Voltage Offset (VREF –

IOUT = –1.5 A

–30

0

30

VTT) for DDR I

(3)

IOUT = 1.5 A

–30

0

30

IOUT = 0 A

–30

0

30

VTT Output Voltage Offset (VREF –

IOUT = –0.5 A

–30

0

30

VTT) for DDR II

(3)

VOSVtt

mV

IOUT = 0.5 A

–30

0

30

IOUT = 0 A

–30

0

30

IOUT = ±0.2 A

–30

0

30

VTT Output Voltage Offset (VREF –

VTT) for DDR III

(3)

IOUT = ±0.4 A

–30

0

30

IOUT = ±0.5 A

–30

0

30

IQ

Quiescent Current (4)

IOUT = 0 A

320

500

µA

ZVDDQ

VDDQ Input Impedance

100

k

Ω

ISD

Quiescent current in shutdown (4)

SD = 0 V

115

150

µA

IQ_SD

Shutdown leakage current

SD = 0 V

2

5

VIH

Minimum Shutdown High Level

1.9

V

VIL

Maximum Shutdown Low Level

0.8

SD = 0 V

Iv

VTT leakage current in shutdown

1

10

µA

VTT = 1.25 V

ISENSE

VSENSE Input current

13

nA

TSD

Thermal Shutdown (5)

165

°C

TSD_HYS

Thermal Shutdown Hysteresis

10

(4)

Quiescent current defined as the current flow into AVIN.

(5)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient thermal

resistance, RθJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die

temperature and the regulator will go into thermal shutdown.

Copyright © 2007–2014, Texas Instruments Incorporated

Submit Documentation Feedback

7

Product Folder Links: LP2998 LP2998-Q1