List of figures

VNH5050A-E

4/33

Doc ID 16009 Rev 11

List of figures

Figure 1.

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2.

Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3.

Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4.

Definition of the delay times measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 5.

Definition of the low-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 6.

Definition of the high-side switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 7.

Definition of dynamic cross conduction current during a PWM operation. . . . . . . . . . . . . . 16

Figure 8.

Definition of delay response time of sense current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 9.

Waveforms in full-bridge operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 10.

Waveforms in full-bridge operation (continued) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 11.

Typical application circuit for DC to 20 kHz PWM operation short circuit protection . . . . . 21

Figure 12.

Behavior in fault condition (how a fault can be cleared) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 13.

Half-bridge configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 14.

Multi-motors configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 15.

PowerSSO-36™ PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 16.

Chipset configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 17.

Auto and mutual Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . 25

Figure 18.

Detailed chipset configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 19.

PowerSSO-36 HSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 27

Figure 20.

PowerSSO-36 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . 27

Figure 21.

Thermal fitting model of an H-bridge in PowerSSO-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 22.

PowerSSO-36 TP package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 23.

PowerSSO-36 TP tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Figure 24.

PowerSSO-36 TP tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 31