ISO1430DWR datasheet(5/49 Pages) TI2

5 / 49 page

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VCC1

Supply voltage, side 1

-0.5

VCC2

Supply voltage, side 2

-0.5

VIO

Logic voltage level (D, DE, RE, R)

-0.5

VCC1+0.5(3)

Output current on R pin

-15

VBUS

Voltage on bus pins (A, B, Y, Z w.r.t GND2)

-18

Junction temperature

-40

150

℃

TSTG

Storage temperature

-65

150

℃

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak

voltage values.

(3)

Maximum voltage must not exceed 6 V

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Contact Discharge, per IEC 61000-4-2

Pins Bus terminals and GND2

±16000

V(ESD)

Contact Discharge, per IEC 61000-4-2

ISO141x, Pins Bus terminals and GND1

(across isolation barrier)

±8000

V(ESD)

Contact Discharge, per IEC 61000-4-2

ISO143x, Pins Bus terminals and GND1

(across isolation barrier)

±8000

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/

ESDA/JEDEC JS-001

All pins except bus pins(1)

±6000

Bus terminals to GND2(1)

±30000

Electrostatic discharge

Charged device model (CDM), per

JEDEC specification JESD22-C101

All pins(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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ISO1450, ISO1452, ISO1410, ISO1412, ISO1430, ISO1432

SLLSF22H – APRIL 2018 – REVISED JUNE 2024

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