6.4 Thermal Information

THERMAL METRIC(1)

ISO1044B

UNIT

D (SOIC)

8 PINS

RΘJA

Junction-to-ambient thermal resistance

119.5

°C/W

RΘJC(top)

Junction-to-case (top) thermal resistance

44.8

°C/W

RΘJB

Junction-to-board thermal resistance

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

28.7

°C/W

ΨJB

Junction-to-board characterization parameter

55.3

°C/W

RΘJC(bot)

Junction-to-case (bottom) thermal resistance

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PD

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL =

60 Ω , TXD with 5V, 5Mbps 50% duty

square wave

146

mW

PD1

Maximum power dissipation (side-1)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL =

60 Ω , TXD with 5V, 5Mbps 50% duty

square wave

15

mW

PD2

Maximum power dissipation (side-2)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, RL =

60 Ω , TXD with 5V, 5Mbps 50% duty

square wave

131

mW

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ISO1044

SLLSFB0A – MARCH 2020 – REVISED JULY 2020

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