L9924L datasheet(52/84 Pages) STMICROELECTRONICS

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Thermal shutdown

L9924L

52/84

DocID028840 Rev 3

Thermal shutdown

Thermal shutdown is automatically accomplished by the Smart Power logic when the

junction temperature reaches 200 degrees.

The system is brought in a safe condition and the microcontroller is powered off for a tTSD

time interval to allow the system temperature to decrease

After the delay the microcontroller is powered again and will find bit 5 of SPI read register

0x12 set.

After 6 trials the system is definitively powered off and can be resumed, if possible, only with

a Power On Reset; the thermal shutdown reset counter can be read and cleared through the

relevant SPI register.

A thermal shutdown condition should never occur and the device SW should keep under

control the junction temperature and take the appropriate actions.

Figure 25. Thermal shutdown diagram

Table 33. Thermal shutdown electrical characteristics

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

Tsd

Thermal shutdown

Guaranteed by design

185

200

215

°C

Thyst

Hysteresis

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