NOTES: (continued)

9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

10. Board assembly site may have different recommendations for stencil design.

EXAMPLE STENCIL DESIGN

4225982/B 07/2021

www.ti.com

HTQFP - 1.2 mm max height

PAP0064N

PLASTIC QUAD FLATPACK

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED COVERAGE BY AREA

SCALE: 8X

SYMM

SYMM

(11.4)

( 5.3)

BASED ON

0.1 THICK STENCIL

64X (1.5)

64X (0.3)

60X (0.5)

(11.4)

METAL COVERED

BY SOLDER MASK

1

16

17

33

48

49

64

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

0.178

3.75 X 3.75

0.152

4.06 X 4.06

0.127

4.44 X 4.44

0.1

5.3X5.3 (SHOWN)

STENCIL

THICKNESS

SOLDER STENCIL

OPENING