NOTES: (continued)

7.

Publication IPC-7351 may have alternate designs.

8.

Solder mask tolerances between and around signal pads can vary based on board fabrication site.

9.

This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, PowerPAD Thermally Enhanced

Package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

EXAMPLE BOARD LAYOUT

4225982/B 07/2021

www.ti.com

HTQFP - 1.2 mm max height

PAP0064N

PLASTIC QUAD FLATPACK

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE: 8X

(11.4)

NON SOLDER MASK

DEFINED

0.05 MAX

ALL AROUND

METAL

SOLDER MASK

OPENING

( 8) NOTE 9

( 5.3)

SOLDER MASK

OPENING

64X (1.5)

64X (0.3)

60X (0.5)

(0.65) TYP

(1.3) TYP

(0.65)

TYP

(1.3)

TYP

(11.4)

SEE DETAIL

METAL COVERED

BY SOLDER MASK

SOLDER MASK

DEFINED PAD

(Ø 0.2) TYP

VIA

1

16

17

32

33

48

49

64