AP22950

Document number: DS47157 Rev. 2 - 2

13 of 15

www.diodes.com

May 2025

© 2025 Copyright Diodes Incorporated. All Rights Reserved.

AP22950

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

U-WLB2515-15

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

U-WLB2515-15

Note:

The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These

dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering

and is calculated by adding 0.2 mm to the

“Z” dimension. For further information, please reference document IPC-7351A, Naming Convention

for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

Note:

For high-voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances

between device Terminals and PCB tracking.

U-WLB2515-15

Dim

Min

Max

Typ

A

0.5470 0.6530 0.6000

A1

0.2250 0.2750 0.2500

A2

0.3000 0.3500 0.3250

A3

0.0220 0.0280 0.0250

b

0.2635 0.3565 0.3100

D

2.5150 2.5700 2.5425

D1

--

--

2.000

D2

--

--

0.2713

D3

--

--

0.2713

E

1.4950 1.5500 1.5225

E1

--

--

1.000

E2

--

--

0.2613

E3

--

--

0.2613

e

--

--

0.50

aaa

--

--

0.0275

bbb

--

--

0.0600

ccc

--

--

0.0300

ddd

--

--

0.1500

All Dimensions in mm

Dimensions

Value

(in mm)

C

0.500

D Ø

0.225

D1 Ø

0.325

e

Øb

ddd

C A B

D

aaa C ( 2x)

bbb C

C

Solder Bump

A3

A2

A1

Seating Plane

A

A

B

aaa C ( 2x)

E

Pin#1

1

2

3

A

B

C

D

E

D2

D1

D3

E2

E1

E3

Pin#1

D1 ( Solder Mask

Opening)

D ( Copper Pad

Diameter)

C

C