CC2560BYFVT datasheet(41/54 Pages) TI2

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Exposed Thermal Pad Dimensions

NOTE: All linear dimensions are in millimeters

RVM (S-PVQFN-N76)

THERMAL INFORMATION

QFN/SON PCB Attachment, Texas Instruments Literature No. SLUA271. This document is available at www.ti.com.

The exposed thermal pad dimensions for this package are shown in the following illustration.

For information on the Quad Flatpack No-Lead (QFN) package and its advantages, refer to Application Report,

This package incorporates an exposed thermal pad that is designed to be attached directly to an external

heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the

PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached

attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the

directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be

integrated circuit (IC).

PLASTIC QUAD FLATPACK NO-LEAD

4212066/B 12/11

3,30±0,10

3,00±0,10

SWRS115-018

CL-

PKG.

CL-

PAD

0,17

CC2560A NRND; CC2564 NRND

CC2560A, CC2560B, CC2564, CC2564B

www.ti.com

SWRS121E – JULY 2012 – REVISED JANUARY 2016

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Product Folder Links: CC2560A CC2560B CC2564 CC2564B

Mechanical, Packaging, and Orderable Information

9.2

Packaging and Ordering

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