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DM160218 bảng dữ liệu(PDF) 29 Page - Microchip Technology

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Giải thích chi tiết về linh kiện  Hillstar Development Kit User’s Guide
PDF  50 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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DM160218 bảng dữ liệu(HTML) 29 Page - Microchip Technology

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MGC3130 HILLSTAR DEVELOPMENT
KIT USER’S GUIDE
 2013 Microchip Technology Inc.
DS40001721A-page 29
Chapter 4. Design In: Hillstar In Target Application
4.1
INTRODUCTION
The Hillstar Development Kit is designed to support an easy integration of Microchip’s
MGC3130 3D Tracking and Gesture Controller into customer’s applications.
The three Hillstar PCBs can be plugged to a PC via USB cable and used for
evaluation of MGC3130 chip and GestIC technology.
During the customer’s design-in process the individual boards can be combined
according to the customers need.
Three examples are given below:
• Combine MGC3130 Unit and I2C to USB Bridge to evaluate customized
electrodes
•Use I2C to USB Bridge to parameterize and debug the MGC3130 application
circuitry in the customer’s design (in-circuit)
• Combine MGC3130 Unit and Electrodes to develop gesture-driven applications
for PC-based or embedded software environments
For in-circuit parameterization and debugging it is mandatory to control the MGC3130
via Aurea Control Software. For that purpose, the customer’s application should
provide an appropriate hardware or software interface.
4.2
INTEGRATION EXAMPLES
The following figures show typical hardware circuits for MGC3130 integration into a
customer’s application.
Figure 4-1 and Figure 4-2 show the control via I2C and an external PC. The Hillstar I2C
to USB Bridge acts as an I2C master, the application processor I2C should be:
• Switched off (I2C lines configured as high Z, refer to Figure 4-1)
• Switched to Slave or Listen mode or
• Disconnected (through an external switch, refer to Figure 4-2)
As an alternative, it is also possible to establish an USB connection between the appli-
cation processor and a PC without using an I2C to USB Bridge. Please refer to Figure
4-3.



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