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TMP235, TMP236

SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings

only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended

OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VDD

+6

V

Output voltage, VOUT

–0.3

(VDD + 0.3)

Output current

–30

+30

mA

Latch-up current, each pin

–200

+200

Junction temperature (TJ)

+150

°C

Storage temperature (Tstg)

–65

+150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM) per JESD22-A114 (1)

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Input voltage (TMP235)

2.3

5.5

V

Input voltage (TMP236)

3.1

5.5

TA

Operating free-air temperature

–40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

For information on self-heating and thermal response time see Layout Guidelines section.

(3)

The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6.4 Thermal Information

THERMAL METRIC (1)(2)

TMP235

UNIT

DCK (SC70)

DBZ (SOT-23)

PINS

PINS

RθJA

Junction-to-ambient thermal resistance(3)(4)

275

167

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

84

90

°C/W

RθJB

Junction-to-board thermal resistance

56

146

°C/W

ΨJT

Junction-to-top characterization parameter

1.2

35

°C/W

ΨJB

Junction-to-board characterization parameter

55

146

°C/W