TFP403

TI

PanelBus™ DIGITAL RECEIVER

SLDS125B − DECEMBER 2000 − REVISED MAY 2011

15

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

detailed description (continued)

PowerPAD 100-TQFP package

The TFP403 is packaged in TI’s thermally enhanced PowerPAD 100TQFP packaging. The PowerPAD package

is a 14 mm × 14 mm × 1 mm TQFP outline with 0.5 mm lead-pitch. The PowerPAD package has a specially

designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.

The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to the die mount

pad for enhanced thermal conduction. Soldering the back side of the TFP403 to the application board is not

required thermally, as the device power dissipation is well within the package capability when not soldered.

Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations.

Since the die pad is electrically connected to the chip substrate and hence chip ground, connection of the

PowerPAD back side to a PCB ground plane will help to improve EMI, ground bounce, and power supply noise

performance.

Table 1 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-PowerPAD

package is included only for reference.

Table 1. TI 100-TQFP (14 × 14 × 1 mm)/0.5 mm Lead Pitch

PARAMETER

WITHOUT

PowerPAD

PowerPAD

NOT CONNECTED TO PCB

THERMAL PLANE

PowerPAD

CONNECTED TO PCB

THERMAL PLANE†

Theta-JA†,‡

45°C/W

27.3°C/W

17.3°C/W

Theta-JC†,‡

3.11°C/W

0.12°C/W

0.12°C/W

Maximum power dissipation†,‡,§

1.6 W

2.7 W

4.3 W

† Specified with 2 oz. Cu PCB plating.

‡ Airflow is at 0 LFM (no airflow)

§ Measured at ambient temperature, TA = 70°C.