PCF8883USSLASH7EASLASH1Y datasheet(29/35 Pages) NXP

29 / 35 page

PCF8883

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Product data sheet

Rev. 4.1 — 14 September 2016

29 of 35

NXP Semiconductors

PCF8883

Capacitive touch/proximity switch with auto-calibration

21. Abbreviations

22. References

[1]

AN10365 — Surface mount reflow soldering description

[2]

AN10439 — Wafer Level Chip Size Package

[3]

AN10706 — Handling bare die

[4]

AN10832 — PCF8883 - capacitive proximity switch with auto-calibration

[5]

AN11122 — Water and condensation safe touch sensing with the NXP

capacitive touch sensors

[6]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[7]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[8]

IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices

[9]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[10] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[11] JESD78 — IC Latch-Up Test

[12] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[13] UM10370 — PCF8883 evaluation board

[14] UM10569 — Store and transport requirements

Table 16.

Abbreviations

Acronym

Description

CMOS

Complementary Metal Oxide Semiconductor

HBM

Human Body Model

Integrated Circuit

Machine Model

MOS

Metal Oxide Semiconductor

MOSFET

Metal–Oxide–Semiconductor Field-Effect Transistor

MSL

Moisture Sensitivity Level

PCB

Printed-Circuit Board

Resistance-Capacitance

Radio Frequency

SMD

Surface Mount Device

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