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PACKAGE OUTLINE

C

8X

0.35

0.25

3 0.05

2X

2.4

1.98 0.05

6X 0.8

0.8

0.7

8X

0.5

0.3

0.05

0.00

(0.1) TYP

A

4.1

3.9

B

4.1

3.9

WSON - 0.8 mm max height

NGU0008B

PLASTIC SMALL OUTLINE - NO LEAD

4214936/A 12/2023

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

SYMM

SYMM

9

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000