4

INA301

SBOS713A – SEPTEMBER 2015 – REVISED FEBRUARY 2016

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Copyright © 2015–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

(3)

Input voltage can exceed the voltage shown without causing damage to the device if the current at that pin is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VS

6

V

Analog inputs (IN+, IN–)

Differential (VIN+) – (VIN–)

(2)

–40

40

V

Common-mode(3)

GND – 0.3

40

Analog input

LIMIT pin

GND – 0.3

(VS) + 0.3

V

Analog output

OUT pin

GND – 0.3

(VS) + 0.3

V

Digital input

RESET pin

GND – 0.3

(VS) + 0.3

V

Digital output

ALERT pin

GND – 0.3

6

V

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

12

V

VS

Operating supply voltage

5

V

TA

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

INA301

UNIT

DGK (MSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

161.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

62.3

°C/W

RθJB

Junction-to-board thermal resistance

81.4

°C/W

ψJT

Junction-to-top characterization parameter

6.8

°C/W

ψJB

Junction-to-board characterization parameter

80

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W