DIX9211 datasheet(3/110 Pages) TI2

3 / 110 page

DIX9211

www.ti.com

SBAS519 – SEPTEMBER 2010

THERMAL INFORMATION

DIX9211

THERMAL METRIC(1)

PT PACKAGE

UNITS

48 PINS

qJA

Junction-to-ambient thermal resistance

61.0

qJCtop

Junction-to-case (top) thermal resistance

0.7

qJB

Junction-to-board thermal resistance

29.6

°C/W

yJT

Junction-to-top characterization parameter

18.9

yJB

Junction-to-board characterization parameter

30.0

qJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

Over operating free-air temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

DIR analog supply voltage, VCC

2.9

3.3

3.6

ALL digital supply voltage, VDD

2.9

3.3

3.6

Coaxial amplifier supply voltage, VDDRX

2.9

3.3

3.6

Digital input interface level

TTL-compatible

DIR, DIT, and Routing sampling frequency

216

kHz

Digital input/output clock frequency

DIR, DIT, and Routing system clock frequency

0.896

55.296

MHz

XTI input clock frequency

24.576

MHz

Digital output load capacitance

Except SCKO

Digital output load capacitance

SCKO

MODE pin capacitance

Operating free-air temperature

–40

+25

+85

°C

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