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TPS28xxY Chip Information

39

39

TPS2816Y

(4)

(2)

(3)

(5)

(1)

OUT

GND

IN

VCC

VDD†

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

(4)

(2)

(3)

(1)

(5)

†TPS2816 through TPS2819 only

TPS2816-EP, TPS2817-EP, TPS2818-EP

TPS2819-EP, TPS2828-EP, TPS2829-EP

SGDS039 – FEBRUARY 2008

This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal

compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be

mounted with conductive epoxy or a gold-silicon preform.

TERMINAL FUNCTIONS

TPS2816, TPS2818, TPS2828 (Inverting Driver)

TERMINAL

DESCRIPTION

NAME

NO.

VDD

1

Regulator supply voltage input. (Not connected on TPS2828)

GND

2

Ground

IN

3

Driver input.

OUT

4

Driver output, OUT = IN

VCC

5

Driver supply voltage/regulator output voltage

TERMINAL FUNCTIONS

TPS2817, TPS2819, TPS2829 (Noninverting Driver)

TERMINAL

DESCRIPTION

NAME

NO.

VDD

1

Regulator supply voltage input. (Not connected on TPS2829)

GND

2

Ground

IN

3

Driver input.

OUT

4

Driver output, OUT = IN

VCC

5

Driver supply voltage/regulator output voltage

4

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Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP