_

+

Driver 1

Driver 2

_

+

3

4

5

17

16

2

1

18

19

20

VCC+

VCC+

VCC–

VCC–

1OUT

2OUT

1IN+

1IN–

2IN+

2IN–

THS6012

SLOS226F – SEPTEMBER 1998 – REVISED JUNE 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Table 1. AVAILABLE OPTIONS

PACKAGED DEVICE

PowerPAD PLASTIC

TA

MicroStar Junior

EVALUATION

SMALL OUTLINE(1)

(GQE)

MODULE

(DWP)

0°C to 70°C

THS6012CDWP

THS6012CGQE

THS6012EVM

-40°C to 85°C

THS6012IDWP

THS6012IGQE

—

(1)

The PWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,

THS6012CPWPR)

FUNCTIONAL BLOCK DIAGRAM

2

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