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LS1021ASE7MQB bảng dữ liệu(PDF) 2 Page - NXP Semiconductors |
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LS1021ASE7MQB bảng dữ liệu(HTML) 2 Page - NXP Semiconductors |
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2 / 205 page ![]() Table of Contents 1 Introduction.......................................................................................... 3 2 Pin assignments.................................................................................... 4 2.1 LS1021A Ball Map and Pin List............................................... 4 3 Electrical characteristics.......................................................................51 3.1 Overall DC electrical characteristics......................................... 51 3.2 Power sequencing......................................................................58 3.3 Power-down requirements.........................................................61 3.4 Power characteristics................................................................. 61 3.5 I/O DC power supply recommendation.....................................63 3.6 Power-on ramp rate................................................................... 66 3.7 Input clocks............................................................................... 67 3.8 RESET initialization..................................................................74 3.9 DDR3L and DDR4 SDRAM controller.................................... 75 3.10 DUART interface...................................................................... 81 3.11 Ethernet interface, Ethernet management interface, IEEE Std 1588........................................................................................... 83 3.12 QUICC engine specifications.................................................... 100 3.13 USB 2.0 interface...................................................................... 106 3.14 USB 3.0 interface...................................................................... 109 3.15 Integrated flash controller (IFC)................................................113 3.16 LPUART interface.....................................................................122 3.17 Flextimer interface.....................................................................124 3.18 FlexCAN interface.....................................................................126 3.19 SAI/I2S interface....................................................................... 128 3.20 SPDIF interface......................................................................... 132 3.21 SPI interface.............................................................................. 134 3.22 QuadSPI interface......................................................................139 3.23 Enhanced secure digital host controller (eSDHC).....................141 3.24 JTAG controller.........................................................................150 3.25 I2C interface.............................................................................. 153 3.26 GPIO interface...........................................................................156 3.27 GIC interface............................................................................. 158 3.28 Display controller unit (2D-ACE)............................................. 160 3.29 High-speed serial interfaces (HSSI).......................................... 162 4 Hardware design considerations...........................................................183 4.1 Power supply design..................................................................183 4.2 Decoupling recommendations................................................... 188 4.3 SerDes block power supply decoupling recommendations.......189 4.4 Connection recommendations................................................... 189 4.5 Thermal......................................................................................194 4.6 Recommended thermal model...................................................194 4.7 Temperature diode.....................................................................195 4.8 Thermal management information............................................ 195 5 Package information.............................................................................198 5.1 Mechanical dimensions of the FC-PBGA................................. 198 6 Security fuse processor.........................................................................200 7 Ordering information............................................................................200 7.1 Part numbering nomenclature....................................................200 7.2 Orderable part numbers addressed by this document................201 8 Revision history....................................................................................202 QorIQ LS1021A Data Sheet, Rev. 5, 09/2017 2 NXP Semiconductors |
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