LP5952

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SNVS469F – OCTOBER 2006 – REVISED DECEMBER 2015

6.4 Thermal Information

LP5952

THERMAL METRIC(1)

YZR (DSBGA)

NKH (USON)

UNIT

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance(2)

181.0

181.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.9

93.1

°C/W

RθJB

Junction-to-board thermal resistance

110.3

116.7

°C/W

ψJT

Junction-to-top characterization parameter

7.4

8.0

°C/W

ψJB

Junction-to-board characterization parameter

110.3

116.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special attention must be paid to thermal dissipation issues in board design.

6.5 Electrical Characteristics

Unless otherwise noted, typical values are for TA = 25°C, and minimum and maximum limits apply over the full operating

temperature range: –40°C

≤ TJ ≤ +125°C; specifications apply to the Typical Application Circuit with VIN = VOUT(NOM) + 1 V,

VBATT = VOUT(NOM) + 1.5 V or 2.5 V (whichever is higher), IOUT = 1 mA, CVIN = 1 µF, COUT = 2.2 µF, VEN = VBATT.

(1) (2) (3)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN = VOUT(NOM) + 0.3 V, TA = 25°C

–1.5

1.5

ΔVOUT / VOUT

Output voltage tolerance

VIN = VOUT(NOM) + 0.3 V

2

2

VIN = VOUT(NOM) + 0.3 V to 4.5 V, VBATT =

1

0.3

1

mV/V

ΔVOUT / ΔVIN

4.5 V

Line regulation error

ΔVOUT /

VBATT = VOUT(NOM) + 1.5 V (≥ 2.5 V) to 5.5

2.2

2.2

0.5

ΔVBATT

V

DSBGA

30

IOUT = 1 mA to 350 mA

15

30

µV/mA

package

ΔVOUT / ΔmA

Load regulation error

USON

60

IOUT = 1 mA to 350 mA

43

60

µV/mA

package

Output current (short

VOUT = 0 V, VEN = VIN = VBATT = VOUT(NOM)

ISC

350

500

mA

circuit)

+ 1.5 V

IOUT = 350 mA, VIN =

DSBGA

1.07

1.5

V

VOUT(NOM) + 0.3 V

package

IOUT = 350 mA

USON

1.08

1.5

V

VIN = VOUT(NOM) + 0.3 V

package

VDO_VBATT

Output voltage dropout

(4)

VBATT

(5)

IOUT = 150 mA

DSBGA

0.96

1.3

V

VIN = VOUT(NOM) + 0.3 V

package

IOUT = 150 mA

USON

0.97

1.3

V

VIN = VOUT(NOM) + 0.3 V

package

IOUT = 350 mA

DSBGA

VBATT = VOUT(NOM) + 1.5 V

88

200

mV

package

or 2.5 V

Output voltage dropout

VDO_VIN

VIN

IOUT = 350 mA

USON

VBATT = VOUT(NOM) + 1.5 V

128

250

mV

package

or 2.5 V

EN

Output noise

10 Hz to 100 kHz

100

µVRMS

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the

most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = VOUT(NOM) + 1 V, VBATT = VOUT(NOM) + 1.5 V

or 2.5 V, whichever is higher, TA = 25°C.

(3)

VOUT(NOM) is the stated output voltage option

(4)

This specification does not apply if the battery voltage VBATT needs to be decreased below the minimum operating limit of 2.5 V during

this test.

(5)

Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output

voltage.

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