LP5952

SNVS469F – OCTOBER 2006 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

IN, BATT pins: Voltage to GND, VIN ≤ VBATT

–0.2

V

BATT pin to IN pin

0.2

V

EN pin, voltage to GND

–0.2

V

Continuous power dissipation(4)

Internally limited

Junction Temperature (TJ-MAX )

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military or Aerospace specified devices are required, contact Texas Instruments Sales Office or Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and

disengages at TJ = 145°C (typical).

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage, VIN

0.7

4.5

V

Input voltage, V

BATT

2.5

5.5

V

Input voltage, VEN

0

VBATT

V

Recommended load current

0

350

mA

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

(1)

–40

85

°C

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

4

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