LP8720

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SNVS575B – JULY 2008 – REVISED MAY 2013

Thermal Shutdown

The Thermal Shutdown (TSD) function monitors the chip temperature to protect the chip from temperature

damage caused eg. by excessive power dissipation. The temperature monitoring function has two threshold

values, TSD and TSD_EW, that result in protective actions.

When TSD_EW +125ºC is exceeded, IRQ_N is set to low, and “1” is written to the TSD_EW bit in both the

STATUS register and in INTERRUPT register.

If the temperature exceeds TSD +160ºC, then PMU initiates Emergency Shutdown.

The POWER-UP operation after Thermal Shutdown can be initiated only after the chip has cooled down to the

+115ºC threshold.

Parameter

Typ

Unit

TSD(1)

160

°C

TSD_EW(1)

125

°C

TSD_EW Hysteresis(1)

10

°C

(1)

Ensured by design.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Absolute Maximum Ratings

(1) (2) (3)

VBATT = VINB, VBATT

-0.3V to +6V

VIN1, VIN2

-0.3V to VBATT+0.15V, max 6V

All other pins

-0.3V to VBATT+0.3V, max 6V

Junction Temperature (TJ-MAX)

150ºC

Storage Temperature

-40 to 150ºC

Maximum Continuous Power Dissipation, PD-MAX

(4)

1.75 W

2 kV HBM

ESD(5)

200V MM

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula P = (TJ –

TA)/θJA, (eq. 1) where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal

resistance. The 1.75-W rating appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction

temperature, 150ºC for TJ, 70ºC for TA, and 45°C/W for θJA. More power can be dissipated safely at ambient temperatures below 70°C.

Less power can be dissipated safely at ambient temperatures above 70°C. The Absolute Maximum power dissipation can be increased

by 22 mW for each degree below 70°C, and it must be de-rated by 22 mW for each degree above 70ºC.

(5)

The human-body model is 100 pF discharged through 1.5 k

Ω. The machine model is a 200-pF capacitor discharged directly into each

pin, MIL-STD-883 3015.7.

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