4

LP358, LP2904

SLOS475A – AUGUST 2005 – REVISED MAY 2017

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Copyright © 2005–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.

(3)

Differential voltages are at IN+, with respect to IN–.

(4)

Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

6 Specifications

6.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage range(2)

±16 or 32

V

VID

Differential input voltage(3)

±32

V

VI

Input voltage (either input)

–0.3

32

V

Duration of output short circuit (one amplifier) to ground at (or below) TA =

25°C, VCC ≤ 15 V

(4)

Unlimited

Operating virtual temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

3

32

V

VCM

Common-mode voltage

0

VCC – 1.5 V

V

TA

Operating free-air temperature

LP358

0

70

°C

LP2904

–40

85

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

THERMAL METRIC(1)

LP358

LP2904

UNIT

D, DGK

(SOIC)

D, DGK (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance (2) (3)

118.8

118.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

71.7

71.7

°C/W

RθJB

Junction-to-board thermal resistance

68.6

68.6

°C/W

ψJT

Junction-to-top characterization parameter

23.3

23.3

°C/W

ψJB

Junction-to-board characterization parameter

67.7

67.7

°C/W