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LM5111

SNVS300H – JULY 2004 – REVISED SEPTEMBER 2016

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Copyright © 2004–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Options....................................................... 3

6

Pin Configuration and Functions ......................... 3

7

Specifications......................................................... 4

7.1

Absolute Maximum Ratings ...................................... 4

7.2

ESD Ratings.............................................................. 4

7.3

Recommended Operating Conditions ....................... 4

7.4

Thermal Information .................................................. 4

7.5

Electrical Characteristics........................................... 5

7.6

Switching Characteristics .......................................... 5

7.7

Typical Characteristics .............................................. 7

8

Detailed Description .............................................. 9

8.1

Overview ................................................................... 9

8.2

Functional Block Diagram ......................................... 9

8.3

Feature Description................................................. 10

8.4

Device Functional Modes........................................ 10

9

Application and Implementation ........................ 11

9.1

Application Information............................................ 11

9.2

Typical Application ................................................. 11

10

Power Supply Recommendations ..................... 13

10.1

Bias Supply Voltage .............................................. 13

11

Layout................................................................... 13

11.1

Layout Guidelines ................................................. 13

11.2

Layout Example .................................................... 14

11.3

Thermal Considerations ........................................ 14

12

Device and Documentation Support ................. 17

12.1

Receiving Notification of Documentation Updates 17

12.2

Community Resources.......................................... 17

12.3

Trademarks ........................................................... 17

12.4

Electrostatic Discharge Caution ............................ 17

12.5

Glossary ................................................................ 17

13

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (March 2013) to Revision H

Page

•

Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table,

Recommended Operating Conditions table, Thermal Information table, Feature Description section, Device

Functional Modes section, Application and Implementation section, Power Supply Recommendations section,

Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision F (March 2013) to Revision G

Page

•

Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 16