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PACKAGE OUTLINE

C

10X

0.35

0.25

3 0.1

2.6 0.1

0.8

0.7

8X 0.8

10X

0.5

0.3

(0.1) TYP

2X

3.2

0.05

0.00

B

4.1

3.9

A

4.1

3.9

(0.2)

WSON - 0.8 mm max height

DPR0010A

PLASTIC SMALL OUTLINE - NO LEAD

4218856/B 01/2021

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

5

6

10

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

SEE ALTERNATIVE

LEAD DETAIL

11

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

20.000

FULL R

ALTERNATIVE LEAD

DETAIL

BOTTOM VIEW

SIDE VIEW