1

IN

8

VDD

2

GND

7

OE

3

GND

6

OUT

4

GND

5

FS

Not to scale

3

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5 Pin Configuration and Functions

PW Package

8-Pin TSSOP

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

FS

5

I

Frequency multiplication selection, internal pullup

GND

2, 3, 4

Ground

Ground

IN

1

I

LVCMOS clock input

OE

7

I

Output enable, internal pullup

OUT

6

O

LVCMOS clock output

VDD

8

Power

3.3-V power supply

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Supply voltage

–0.5

4.6

V

VIN

Input voltage

–0.5

4.6

V

Vout

Output voltage

–0.5

4.6

V

IIN

Input current (VI < 0, VI > VDD)

20

mA

Iout

Continuous output current

50

mA

TJ

Maximum junction temperature

125

°C

Tstg

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±1500

V

Charged-device model (CDM), per AEC Q100-011

±750