www.ti.com

EXAMPLE STENCIL DESIGN

44X (0.5)

48X (1.6)

48X (0.3)

(R0.05) TYP

(8.5)

(8.5)

PowerPAD

TQFP - 1.2 mm max height

PHP0048C

PLASTIC QUAD FLATPACK

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:8X

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

BASED ON

0.125 THICK STENCIL

SYMM

SYMM

48

37

13

24

25

36

1

12

METAL COVERED

BY SOLDER MASK

49

3.89 X 3.89

0.175

4.2 X 4.2

0.150

4.6 X 4.6 (SHOWN)

0.125

5.14 X 5.14

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

4226381/A 11/2020

(4.6)

(4.6)

BASED ON

0.125 THICK

STENCIL