1

2

3

7

4

5

6

14

13

12

8

11

10

9

1A

1B

1Y

2A

2B

2Y

GND

4B

4A

4Y

3B

3A

V

CC

3Y

3

CD74HC08-Q1

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SCLS512B – JULY 2003 – REVISED APRIL 2020

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5 Pin Configuration and Functions

D Package

14-Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

1A

1

Input

Channel 1, Input A

1B

2

Input

Channel 1, Input B

1Y

3

Output

Channel 1, Output Y

2A

4

Input

Channel 2, Input A

2B

5

Input

Channel 2, Input B

2Y

6

Output

Channel 2, Output Y

GND

7

—

Ground

3Y

8

Output

Channel 3, Output Y

3A

9

Input

Channel 3, Input A

3B

10

Input

Channel 3, Input B

4Y

11

Output

Channel 4, Output Y

4A

12

Input

Channel 4, Input A

4B

13

Input

Channel 4, Input B

VCC

14

—

Positive Supply

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

Guaranteed by design.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input clamp current(2)

VI < –0.5 V or VI > VCC +

0.5 V

±20

mA

IOK

Output clamp current(2)

VO < –0.5 V or VO > VCC +

0.5 V

±20

mA

IO

Continuous output current

VO = 0 to VCC

±25

mA

Continuous current through VCC or GND

±50

mA

TJ

Junction temperature(3)

150

°C

Lead temperature (during soldering)

At distance 1/16 ± 1/32

inch (1.59 ± 0.79 mm)

from case for 10 s max

300

°C

Tstg

Storage temperature

–65

150

°C