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ADL6331ACCZB-R7 bảng dữ liệu(PDF) 10 Page - Analog Devices |
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ADL6331ACCZB-R7 bảng dữ liệu(HTML) 10 Page - Analog Devices |
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10 / 54 page ![]() Data Sheet ADL6331 ABSOLUTE MAXIMUM RATINGS analog.com Rev. B | 10 of 54 Table 4. Absolute Maximum Ratings Parameter Rating V33AMP1, V33AMP1A, V33AMP2, V33AMP2A, V33FUSE −0.3 V to +3.6 V RFINN, RFINP 10 dBm SCLK, SDO, SDIO, CSB, CA0, CA1, CA2, ENP, ATTSEL0, ATTSEL1 −0.3 V to +3.6 V Maximum Junction Temperature 125°C Operating Temperature Range (Measured at the exposed pad) −40°C to +105°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the conduction thermal resistance from junction to case where the case temperature is measured at the bottom of the package. The thermal resistance value specified in Table 5 is simulated based on JEDEC specifications (unless specified otherwise) and must be used in compliance with JESD51-12. Table 5. Thermal Resistance Package Type θJC Unit CC-24-17 9.6 °C/W ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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