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ADA4352-2ACPZ-R7 bảng dữ liệu(PDF) 15 Page - Analog Devices |
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ADA4352-2ACPZ-R7 bảng dữ liệu(HTML) 15 Page - Analog Devices |
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15 / 47 page ![]() Data Sheet ADA4352-2 analog.com Rev 0 15 of 47 PARAMETER RATING Temperature Junction, TJ 150°C Temperature Case, TC 260°C . Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Thermal Resistance Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design is required. θJA is the natural convection junction-to-ambient thermal resistance measured in a one cubic foot sealed enclosure. Thermal Resistance Package Type ӨJA Unit CP-16-32 91 °C/W Maximum Power Dissipation The maximum safe power dissipation for the ADA4352-2 is limited by the associated rise in TJ on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses the package exerts on the die, permanently shifting the parametric performance of the ADA4352-2. Exceeding a TJ of 175°C for an extended period can result in changes in the silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package is the sum of the quiescent power dissipation and the power dissipated in the die due to the output load drive of the amplifier. Figure 3. Output Current Derating Curve MAXIMUM CURRENT (mA) TEMPERATURE (°C) 25 0 20 40 60 80 100 120 50 75 100 125 150 |
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