Bosch Sensortec | BMP384 Datasheet

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Modifications reserved |Data subject not change without notice | Printed in Germany

Document number: BST-BMP384-DS003-11 Revision_1.0_112020

Table of contents

1. Specification.....................................................................................................................................................................6

2. Absolute maximum ratings.............................................................................................................................................8

3. Functional description ....................................................................................................................................................8

3.1. Block diagram...........................................................................................................................................................9

3.2. Power management................................................................................................................................................10

3.3. Power modes ..........................................................................................................................................................10

3.4. Measurement flow ..................................................................................................................................................12

3.5. Filter selection ........................................................................................................................................................16

3.6. FIFO Description.....................................................................................................................................................17

3.7. Interrupts.................................................................................................................................................................21

3.8. Current consumption .............................................................................................................................................25

3.9. Measurement timings.............................................................................................................................................25

3.10.

Data readout from data registers ......................................................................................................................26

3.11.

Output compensation.........................................................................................................................................27

4. Global memory map and register description............................................................................................................28

4.1. General remarks .....................................................................................................................................................28

4.2. Datasheet Memory Map .........................................................................................................................................28

4.3. Register description...............................................................................................................................................30

5. Digital interfaces............................................................................................................................................................39

5.1. Interface selection ..................................................................................................................................................39

5.2. I²C Interface.............................................................................................................................................................39

5.3. SPI interface............................................................................................................................................................41

5.4. Interface parameter specification .........................................................................................................................42

6. Pin-out and connection diagram..................................................................................................................................45

6.1. Pin-out .....................................................................................................................................................................45

6.2. Connection diagram ¾-wire SPI............................................................................................................................46

6.3. Connection diagram I²C .........................................................................................................................................47

7. Package, reel and environment....................................................................................................................................48

7.1. Outline dimensions ................................................................................................................................................48

7.2. Landing pattern.......................................................................................................................................................48

7.3. Marking....................................................................................................................................................................49

7.4. Soldering guidelines ..............................................................................................................................................51

7.5. Tape and reel specification....................................................................................................................................52

7.6. Mounting and assembly recommendations ........................................................................................................53

7.7. Environmental safety .............................................................................................................................................53

8. Legal disclaimer.............................................................................................................................................................54

8.1. Engineering samples .............................................................................................................................................54

8.2. Product use.............................................................................................................................................................54