T6LE2

2006-09-20

11

Power Supply Sequence

Instruction for operating circumstances

• Light striking a semiconductor device can generate electromotive force due to photoelectric effects. In some cases

this may cause the device to malfunction.

This is more likely to be affected for the devices in which the surface (back), or side of the chip is exposed. At the

design phase, please make sure that devices are protected against incident light from external sources. Please take

into account of incident light from external sources during actual operation and during inspection.

• Polyimide base film is hard and thin. Be careful not to injure yourself on the film or to scratch any other parts with the

film. Please design and manufacture products so that there is no chance of users touching the film after assembly, or

if they do that, there is no chance of them injuring themselves. When cutting out the film, please ensure that the film

shavings do not cause accidents. After use, please treat the leftover film and reel spacers as industrial waste.

50%

50%

G1 to G300

XDON

50%

50%

50%

50%

50%

50%

Input

OE

L/R, CPVL/R

Output

OE

L/R, CPVL/R

20%

20%

80%