TMPR4956C datasheet(39/286 Pages) TOSHIBA

39 / 286 page

Handling Precautions

(6) With tape carrier package (TCPs) devices, the backside of the LSI chips is exposed. To ensure that the chip

will not crack, mount the device so that mechanical shock is not applied to the LSI backside. In addition,

electrical contact may also cause LSI failure. Mount the device so that there is no electrical contact with the

backside of the LSI chip.

If you are mounting the backside of the LSI chip to improve device characteristics, please contact your

nearest Toshiba office or distributor in advance.

3.5.7

Chips Mounting

Devices delivered in chip form readily deteriorate or become damaged due to external factors in comparison

with plastic-packaged products. Attention is therefore required during handling.

(1) Mount devices in a properly maintained environment so that the chip will not be exposed to contaminated

ambient air or other substances.

(2) When handling chips, be careful not to expose the chips to static electricity. In particular, measures must be

taken to prevent electrostatic breakdown during chip mounting. For this purpose, it is recommended that

you mount all peripheral devices before you mount the chips.

(3) Use chip mounting circuit boards (such as PCBs) that do not have any chemical residue on them (such as

the chemicals used during PCB etching).

(4) When mounting chips, use the method of assembly that is most suitable for achieving the appropriate

electrical, thermal and mechanical characteristics of the semiconductor product used.

For chip details, refer to the relevant specification sheet.

3.5.8

Circuit Board Coating

When using devices that require high reliability or devices used under extreme environments (where moisture,

corrosive gas or dust is present), circuit boards are sometimes coated with a moisture-proof coating. When using

a coating resin, choose the coating resin which results in minimal stress to the device.

3.5.9

Heat Sinks

(1) When installing a heat sink to a device, use the specified accessories. In addition, be careful not to apply

excessive force to the device during installation.

(2) When installing a device to a heat sink by fixing it in two or more locations, do not tighten one location to

the specified torque while the rest are left not tightened. Rather, lightly tighten all locations evenly first and

tighten all locations to the specified torque by rotation.

(3) Drill screw holes in the heat since as specified, and smooth the surface of the

device installation area by removing burrs and protrusions or indentations.

(4) Thinly applying silicone grease between the heat sink makes device better to

improve heat conductivity compared with no grease. If you choose to apply the

silicone grease, use a non-volatile type. Volatile type silicone grease can cause

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