ST1S10

Layout considerations

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6.1

Thermal considerations

The leadframe die pad, of ST1S10, is exposed at the bottom of the package and must be

soldered directly to a properly designed thermal pad on the PCB, the addition of thermal

vias from the thermal pad to an internal ground plane will help increase power dissipation.

Figure 7.

PCB layout suggestion

Common ground node

for power ground

I

IN

Power Ground

Common ground node

for power ground

Common ground node

for power ground

I

IN

Power Ground