MNSC140CORE datasheet(37/88 Pages) FREESCALE

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Thermal Characteristics

MSC8122 Technical Data, Rev. 13

Freescale Semiconductor

2-3

2.3 Thermal Characteristics

Table 2-3 describes thermal characteristics of the MSC8122 for the FC-PBGA packages.

Section 4.5, Thermal Considerations provides a detailed explanation of these characteristics.

2.4 DC Electrical Characteristics

This section describes the DC electrical characteristics for the MSC8122. The measurements in Table 2-4 assume

the following system conditions:

•TA = 25 °C

•

VDD =

— 300/400 MHz 1.1 V nominal = 1.07–1.13 VDC

— 400 MHz 1.2 V nominal = 1.14–1.26 VDC

— 500 MHz 1.2 V nominal = 1.16–1.24 VDC

•

VDDH = 3.3 V ± 5% VDC

•

GND

= 0 VDC

Note:

The leakage current is measured for nominal VDDH and VDD.

Table 2-3.

Thermal Characteristics for the MSC8122

Characteristic

Symbol

FC-PBGA

× 20 mm5

Unit

Natural

Convection

200 ft/min

(1 m/s) airflow

Junction-to-ambient1, 2

RθJA

°C/W

Junction-to-ambient, four-layer board1, 3

RθJA

°C/W

Junction-to-board (bottom)4

RθJB

°C/W

Junction-to-case5

RθJC

0.9

°C/W

Junction-to-package-top6

ΨJT

°C/W

Notes:

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on

the top surface of the board near the package.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

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