PPC440GP-3RC400C datasheet(57/83 Pages) AMCC

57 / 83 page

440GP – Power PC 440GP Embedded Processor

AMCC

Revision 1.07 – October 4, 2007

Data Sheet

Heat Sink Mounting Information (Ceramic Package Only)

Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat

sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be

attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a

mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive

mechanical stress on bonding of the chip to the substrate and the package to the board.

Heat Sink Attached With Spring Clip

Heat Sink Attached With Adhesive

Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the

shock and vibration effects of any particular application.

Heat sink

Thermal grease

Printed

circuit

board

CBGA

package

Heat sink

Heat sink clip

Printed

circuit

board

CBGA

package

Spring clip to board

Spring clip to package

Thermal grease

Heat sink clip

Static compression (spring force)—2.27kg maximum

Static compression (spring force)—2.27kg maximum1

Note 1: Force is limited by allowable compression on the die.

Allowable package compression force is 4.4kg.

Heat sink

Printed

circuit

board

CBGA

package

Adhesive

Heat sink

Printed

circuit

board

CBGA

package

Adhesive

Heat sink weight force—60g maximum

Weight

force

Weight

force

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